tungsten . carbide probe . a) ... the resistivity of the two types of polysilicon is virtually identical and appears to be limited by the solid solubility of phosphorus in silicon, indicating a ...
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Application of Tungsten silicide WSi2 powder CAS 1: WSi2 is often used as an electric shock material in microelectronics, where the resistance is 60-80μΩcm. At the same time, it is often used as a shunt on the polysilicon line to increase the conductivity and signal speed of the polysilicon line.
The emissivity coefficient - ε - indicates the radiation of heat from a 'grey body' according the Stefan-Boltzmann Law, compared with the radiation of heat from a ideal 'black body' with the emissivity coefficient ε = 1. The emissivity coefficient - ε - for some common materials can be found in the table below. Note that the emissivity coefficients for some products varies with the temperature.
It can be widely used in the processing of high hardness materials.Such as zirconia, alumina, boron carbide, tungsten carbide, silcarbide, stone, glass, ceramic, monocrystalline silicon, polysilicon, metal-nonmetallic synthetic materials, titanium alloy, tungsten manganese alloy and other hard brittle materials complex surface grinding processing.
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Tungsten silicide (WSi 2) is an inorganic compound, a silicide of tungsten.It is an electrically conductive ceramic material.. Chemistry. Tungsten silicide can react violently with substances such as strong acids, fluorine, oxidizers, and interhalogens.. Applications. It is used in microelectronics as a contact material, with resistivity 60–80 μΩ cm; it forms at 1000 °C.
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Mohs' Hardness (Typical) of Abrasives table from READE. Abrasive blasting for surface preparation is an important step in providing a foundation for protective coatings. For years, tests have concluded that high-performance coatings provide excellent corrosion protection and durability when applied over a blast-cleaned surface with a consistent anchor profile.
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R. Ballarini et al.: The fracture toughness of polysilicon microdevices (e) FIG. 1. (continued from previous page.) microdevices, a rigid probe was used to wedge open the 2 mm wide notch, as shown in Fig. 2(a). The shaft of the tungsten carbide probe is 0.020″in diameter and tapers to a conical point, with an inclusive angle of 15–,toa tip ...
Tungsten carbide is a chemical compound containing equal parts of tungsten and carbon atoms. In its most basic form, tungsten carbide is a fine gray powder, but it can be pressed and formed into shapes through a process called sintering for use in industrial machinery, cutting tools, abrasives, armor-piercing rounds, other tools and instruments ...
Tungsten disilic ide (WSi2) has a density of 9.3g/cm3 and a melting point of 2160℃. It has good oxidation resistance, and is soluble in aqua regia with h ydrogen f luoride (a mixture of concentrated hydrofluoric acid (HF) and concentrated
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Silicon nitride is a chemical compound of the elements silicon and nitrogen. Si 3 N 4 is the most thermodynamically stable of the silicon nitrides. Hence, Si 3 N 4 is the most commercially important of the silicon nitrides when referring to the term "silicon nitride". It is a white, high-melting-point solid that is relatively chemically inert, being attacked by dilute HF and hot H
Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization Shui Jinn Wang, Hao Yi Tsai and Shi Chung Sun-Effects of Tungsten Polycide Process and Post-Polyoxidation Rapid Thermal Process on Electrical Characteristics of Thin Polysilicon Oxide Kuo-Ching Huang, Yean-Kuen Fang, Dun-Nian Yaung et al.-Analysis of Peeling Mechanism in
The ability to form such fluoride free tungsten films with the assistance of activated hydrogen species, permits the deposition of tungsten directly onto gate oxides thereby enabling the formation of tungsten gate electrodes without underlying polysilicon. Low conductivity tungsten contacts including in-situ formed tungsten compound barrier ...
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Polysilicon rods from the Siemens process are crushed into fragments and further processed to fragments having very low metal contamination in an economical manner by purposefully fabricating parts contacting the polysilicon from materials which cause high metal contamination, and removing the metal contamination by a cleaning bath or baths tailored to the particular metal contamination.
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Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of thick hardmask films on a substrate. In one implementation, a method of forming a hardmask layer on a substrate is provided. The method comprises applying a chucking voltage to a substrate positioned ...
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Jul 10, 2008· Filed: August 27, 2007. Date of Patent: May 1, 2012. Assignee: Cabot Microelectronics Corporation. Inventors: Hui-Fang Hou, Wen-Cheng Liu, Yen-Liang Chen, Jui-Ching Chen. Method of polishing a tungsten carbide surface. Patent number: 8162723. Abstract: The invention is directed to a method for polishing a surface comprising tungsten carbide ...
The fused silica (quartz) ceramic crucible is the key component of the polysilicon ingot furnace for solar panel. It is used as a container for loading polysilicon raw materials to work continuously for more than 50 hours at high temperatures above 1500°C, melting it to produce polysilicon ingots for solar panel, because of its extremely harsh conditions of application, there are extremely ...
Mar 14, 2007· Polysilicon is crushed with a minimum of manual and machine crushing steps by utilizing a large diameter roll crusher, the circumferential crushing surface of which is formed of a plurality of reversibly mounted, close fitting hard metal plates. Reproducible crushing along with such low metal contamination that subsequent cleaning of the crushed polysilicon is not necessary are both obtained.